3D IC Market to Reach USD 22.30 Billion by 2027 | CAGR of 16.6% | Reports And Data

3D IC Market to Reach USD 22.30 Billion by 2027 | CAGR of 16.6% | Reports And Data

PR Newswire

NEW YORK, July 2, 2020

A surge in demand for smart devices and a growing emphasis on miniaturization in the electronics industry are among the significant factors influencing the market growth

Market Size – USD 6.48 Billion in 2019, Market Growth - CAGR of 16.6%, Market Trends – Growth of the gaming industry

NEW YORK, July 2, 2020 /PRNewswire/ -- The global 3D IC market is expected to reach USD 22.30 Billion by 2027, according to a new report by Reports and Data. 3D ICs (Integrated Circuits) provide technical and economic enhancements in efficiency, architecture design, form factor, power, cost, time-to-market, and risk, and thereby drives the market demand. 3D integration has the potential to escalate integration density provides the prospective to considerably diminish interconnect delays and enhance performance of the system considerably. Additionally, the reduced wire length particularly that of the clock network, reduces the power consumption of circuits. Further, the technology offers a flexible means to achieve the heterogeneous SoC (System on Chip) design by the integration of distinct technologies, comprising memory and logic circuits, mixed-signal and radio frequency (RF) components, and optoelectronic devices, among others, onto different dies of a 3D IC.

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A surge in demand for smart devices, such as smartphones and tablets, is fuelling the growth of the market. 3D IC allows for more sophisticated integrations, comprising of multi-axis accelerometers, microphones, and gyroscopes, for smartphones. The introduction of 5G services and devices, along with increasing demand in countries such as India, Russia, and Indonesia, would propel the demand for smartphones. Further, e-commerce companies, including Amazon and Flipkart, among others, pull customers with special discounts on smartphones, and, in turn, drive the market demand. The global smartphone shipments are estimated to add up to about 1.48 billion units in the year 2023.

However, high costs associated with 3D ICs, as well as concerns owing to thermal issues resulting from high-level integration, may hamper the growth of the market in the upcoming years.

COVID-19 Impact

The COVID-19 pandemic resulted in a shock to both demand and supply across the globe. It is estimated the semiconductor industry would witness a decline of 5.0% to 15.0% in the current year as compared to 2019. The consumer electronics and the automotive sector are amongst the hardest hit end-user industries for 3D ICs. The lack of movement, owing to mandatory lockdown, has led to a decline in the sales of automotive, as well the consumer electronics product, which, in turn, is pulling down the demand for 3D ICs.

To identify the key trends in the industry, click on the link below:
https://www.reportsanddata.com/report-detail/3d-ic-market

Further key findings from the report suggest

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For the purpose of this report, Reports and Data have segmented the global 3D IC market on the basis of application, type, industry verticals, and region:

Application Outlook (Revenue, USD Million; 2017-2027)

Type Outlook (Revenue, USD Million; 2017-2027)

Industry Verticals Outlook (Revenue, USD Million; 2017-2027)

Regional Outlook (Revenue, USD Million; 2017-2027)

Browse more similar reports on Semiconductor category by Reports And Data

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