Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year

Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year

PR Newswire

MILPITAS, California, Nov. 2, 2020

MILPITAS, California, Nov. 2, 2020 /PRNewswire/ -- Worldwide silicon wafer area shipments contracted 0.5% to 3,135 million square inches in the third quarter of 2020 compared to the second quarter of the year but registered a 6.9% increase from the 2,932 million square inches shipped one year ago during the same quarter, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SEMI® connects 2,000+ member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. SEMI builds connections that help its members prosper, create new markets, and address common industry challenges together. Visit http://www.semi.org

"After a strong rebound in the first half of 2020, global silicon wafer shipments in the third quarter were flat to the previous quarter," said Neil Weaver, chairman of SEMI SMG and vice president of Product Development and Applications Engineering at Shin Etsu Handotai America.

 Silicon Area Shipment Trends - Semiconductor Applications Only


Millions of Square Inches


2Q 2019

3Q 2019

4Q 2019

1Q 2020

2Q 2020

3Q 2020

Total

2,983

2,932

2,844

2,920

3,152

3,135

Source: SEMI (www.semi.org), November 2020

All data cited in this release includes polished silicon wafers such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin, round disks are produced in various diameters – from one inch to 12 inches – and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The purpose of the SMG is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org

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